Advancing Chiplet Technology for
Future Connectivity™

H3C Co-Packaged Optics (CPO):​ Principle and Measurement

Copyright by 新華三

Co-Packaged Optics (CPO)
- Principle and Performance

Latest AI Computing
- Integration and Scalability

The NVIDIA Rubin Platform: ​Six New Chips, One AI Supercomputer​

copyright by NVIDia

Integrating optical engine and electronic chip into a single module​.

Higher data rate, lower latency, lower power consumption and more efficient heat dissipation​.

Connecting thousands of GPUs via optical to create the world's most powerful AI factories​.

Use NVLink/PCIe for inter-rack interconnection​.